Confocal NEXIV – VMF-K3040 or VMF-K6555
| VMF-K (Both optical & confocal combined) | |
| – 2 Possible Stage Sizes X Y Z | 300 x 400 x 150 |
| 650 x 650 x 150 | |
| – EUX, MPE, EUY, MPE: | 1.5 + 4L/1000 μm |
| – EUXY, MPE: | 2.5 + 4L/1000 μm |
| – 5 optical heads possible | 1.5x, 3x, 7.5x, 15x, 30x |
Extra : TTL Laser (line scan, area scan and layer thickness)
Optional: Wafer holder, Wafer Loader, …
Measuring software:
- AutoMeasure
- NEXIV Map Measure (recipe generation, execution & result review)
- NEXIV Profiler
- NEXIV Report
- NEXIV EDF / Stitching Express
Bumbs
Wire bonding
Bumb
Ultra High Accuracy NEXIV – VMZ-H3030
| Type | Stage size X Y Z |
| VMZ-H3030 (Ultra High Precision) | 300 x 300 x 150 |
| – EUX, MPE, EUY, MPE: 0.6 + 2L/1000 μm | |
| – EUXY, MPE: 0.9 + 3L/1000 μm | |
| – 5 optical heads (type 1,2,3,4 & TZ) |
Options: TTL Laser (line scan, area scan and layer thickness)
Measuring software:
- AutoMeasure
- NEXIV Profiler
- NEXIV Report
- NEXIV EDF / Stitching Express
Wafer - Die alignment
